Process Control, SPC, and Yield Engineering
Students will master the core concepts and methodologies for maintaining high-quality, high-yield semiconductor fabrication processes. The curriculum covers statistical process control (SPC) techniques, control charting, process capability analysis, and strategies for identifying and mitigating yield loss mechanisms in a manufacturing environment. Through practical examples and case studies, learners will develop the analytical skills necessary to monitor, analyze, and optimize semiconductor production lines. Graduates will be equipped to implement and manage robust process control systems, interpret critical manufacturing data, and drive continuous improvement initiatives to enhance product quality and profitability within the semiconductor industry.
Prerequisites
Course outline
Lectures, virtual labs, and graded assignments — completed in your browser.
Syllabus
Week 1: Introduction to Process Control in Semiconductor Manufacturing Week 2: Fundamentals of Variation and Data Analysis Week 3: Basic Statistical Process Control (SPC) Concepts Week 4: Control Charts for Variables (X-bar and R/s Charts) Week 5: Control Charts for Attributes (p, np, c, u Charts) Week 6: Process Capability Indices (Cp, Cpk, Pp, Ppk) Week 7: Interpreting Control Charts and Out-of-Control Conditions Week 8: Introduction to Yield Engineering and Semiconductor Yield Drivers Week 9: Defect Characterization and Analysis Techniques Week 10: Yield Modeling and Prediction Week 11: Root Cause Analysis for Yield Loss Week 12: Advanced Process Control (APC) Overview Week 13: Design of Experiments (DOE) for Process Optimization Week 14: Integrated Process Control and Yield Improvement Strategies